Puya designs & offers industrial level series, ultra-high reliability series and automotive series IIC EEPROM, with the densities ranging from 2Kb to 1024Kb. Based on the excellent quality and outstanding customer service, Puya IIC EEPROM product line has been approved by numerous electronics customers.
Up to 4M cycling and 200 year data retention 6000V HBM / 200mA 125C Latch-up capability 0.5uA standby current / 1.5mA program current 3ms write time/ 1.7V 1MHz bus frequency Safety protection for power on-off / Anti-noise IO design ID page for customer encryption 100% room temperature and high temperature CP Full series SOP/TSSOP/UDFN support / 2K-256K SOT23 support Known Good Die (KGD) support Wafer-Level Chip Scale Package (WLCSP) support
P24C02A-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN
P24C04C-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN / MSOP8 8-lead
P24C08C-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN / MSOP8 8-lead
P24C16C-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN / MSOP8 8-lead
P24C32C-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN
P24C64C-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN
P24C128D-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN
P24C256B-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead
P24C512B-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead
P24CM01B-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead
P24C256-MI
1MHz
1.7~5.5V
-40~85℃
/
200Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead
P24C512-MI
1MHz
1.7~5.5V
-40~85℃
/
200Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead
Known Good Die （KGD） product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....
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Wafer-Level Chips Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options.The die size of Puya products has leading competitiveness,so Puya WLCSP is a true chip-scale package.Puya provides WLCSP SPI NOR Flash,IIC EEPROM&VCN Driver products for mobile or portable form factor applications, such as 3D-CCM，digital cameras，smart watches，GPS navigation device，etc.
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